2014, English, Conference Proceedings edition: Stress-induced phenomena and reliability in 3D microelectronics : Kyoto, Japan, 28-30 May 2012 / editors, Paul S. Ho, University of Texas, Texas, USA, Chao-Kun Hu, IBM T.J. Watson Research Center, New York, USA, Mark Nakamoto, Qualcomm Incorporated, California, USA, Shinichi Ogawa, Advanced Industrial Science and Technology, Ibaraki, Japan, Valeriy Sukharev, Mentor Graphics Corporation, California, USA, Larry Smith, SEMATECH, New York, USA, Ehrenfried Zschech, Frauhofer Institute for Ceramic Technologies and Systems, Dresden, Germany. International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2011 March 17 : Santa Clara, Calif.)

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Stress-induced phenomena and reliability in 3D microelectronics : Kyoto, Japan, 28-30 May 2012 / editors, Paul S. Ho, University of Texas, Texas, USA, Chao-Kun Hu, IBM T.J. Watson Research Center, New York, USA, Mark Nakamoto, Qualcomm Incorporated, California, USA, Shinichi Ogawa, Advanced Industrial Science and Technology, Ibaraki, Japan, Valeriy Sukharev, Mentor Graphics Corporation, California, USA, Larry Smith, SEMATECH, New York, USA, Ehrenfried Zschech, Frauhofer Institute for Ceramic Technologies and Systems, Dresden, Germany
 
Bookmark: https://trove.nla.gov.au/version/228640919
Physical Description
  • 1 online resource (vi, 185 pages) : illustrations (some color).
Published
  • Melville, New York : AIP Publishing, 2014.
Language
  • English

Edition details

Title
  • Stress-induced phenomena and reliability in 3D microelectronics : Kyoto, Japan, 28-30 May 2012 /​ editors, Paul S. Ho, University of Texas, Texas, USA, Chao-Kun Hu, IBM T.J. Watson Research Center, New York, USA, Mark Nakamoto, Qualcomm Incorporated, California, USA, Shinichi Ogawa, Advanced Industrial Science and Technology, Ibaraki, Japan, Valeriy Sukharev, Mentor Graphics Corporation, California, USA, Larry Smith, SEMATECH, New York, USA, Ehrenfried Zschech, Frauhofer Institute for Ceramic Technologies and Systems, Dresden, Germany.
Creator
  • International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2011 March 17 : Santa Clara, Calif.)
Other Creators
  • Ho, P. S, (editor.)
  • Hu, Chao-Kun. (editor.)
  • Nakamoto, Mark, (editor.)
  • Ogawa, Shinichi, (editor.)
  • Sukharev, Valeriy, (editor.)
  • Smith, Larry. (editor.)
  • Zschech, Ehrenfried, (editor.)
  • International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2011 July 13 : San Francisco, Calif.)
  • International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2011 October 12 : Dresden, Germany)
  • International Workshop on Stress-Induced Phenomena in Microelectronics (12th : 2012 : Kyoto, Japan)
Published
  • Melville, New York : AIP Publishing, 2014.
Content Types
  • text
Carrier Types
  • online resource
Physical Description
  • 1 online resource (vi, 185 pages) : illustrations (some color).
Series
Subjects
Notes
  • "Conference collection."
  • "All papers have been peer reviewed."
  • "This volume of proceedings contains papers from three International Workshops 'Stress Management for 3D ICs using Through Silicon Vias - Design for Reliability' held in Santa Clara/​CA, USA on March 17, 2011, in San Francisco/​CA, USA, on July 13, 2011, and in Dresden, Germany, on October 12, 2011, as well as from the 12th International Workshop on Stress-Induced Phenomena in Microelectronics held in Kyoto, Japan, on May 28-30, 2012."--Preface.
  • Includes bibliographical references.
Other Form
  • Print version 9781632667410
Language
  • English
ISBN
  • 9780735412354
  • 0735412359
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