English, Article edition: MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKELâPHOSPHORUS PLATING LAYER JEONG-WON YOON; HYUN-SUK CHUN; HAN-BYUL KANG; ...

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Bookmark: http://trove.nla.gov.au/version/85180
Physical Description
  • article
Language
  • English

Edition details

Title
  • MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKELâPHOSPHORUS PLATING LAYER
Author
  • JEONG-WON YOON
  • HYUN-SUK CHUN
  • HAN-BYUL KANG
  • MIN-HO PARK
  • CHEOL-WOONG YANG
  • HOO-JEONG LEE
  • SEUNG-BOO JUNG
Physical Description
  • article
Notes
  • We studied the growth kinetics and characteristics of electroless nickelâphosphorus (ENâP) deposition layer on Cu substrate in an acid plating bath with sodium hypophosphite as the reducing agent. The individual nodules of the ENâP layer increased in size but decreased in number with increasing plating time and pH, i.e. the root-mean-square (RMS) roughness of the EN deposit decreased. In addition, the plating rate of the EN layer increased with increasing plating bath pH. X-ray diffraction (XRD) analyses revealed that the as-plated deposit was in an amorphous phase, while the heat-treated layer was composed of crystallized Ni and Ni3P compound. The solderability of the EN layer increased with decreasing P content. In addition, the wetting force increased with increasing surface roughness. The present study clearly showed that the solderability behavior of the EN layer is affected by both surface composition (P content) and morphology.
  • Electroless nickel-phosphorus plating, surface morphology, solderability
  • RePEc:wsi:srlxxx:v:14:y:2007:i:04:p:827-832
Language
  • English
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