STUDY OF A BIMATERIAL SYSTEM BY AN IMPROVED DYNAMICAL THERMAL MODEL
A. I. OLIVA
R. D. MALDONADO
J. E. CORONA
H. G. RIVEROS
We present an improved dynamical thermal model and the corresponding experimental efforts to determine thermal profiles of thin metallic films deposited on thick substrates (bimaterial system) as are usually used in microelectronics. A dynamical thermal model to characterize the Joule heating of a metallic film/substrate system, as a function of the applied energy and the thickness is discussed. Good agreement between theoretical and measured thermal profiles on different bimaterial systems support the theoretical model obtained by solving a harmonic oscillator equation. By combining the thermal model and the experimental results it is possible to determine the convective coefficient of the room conditions, the diffusive time constant, and to quantify the different mechanisms of heat loss as a function of the physical properties and the geometrical parameters. The improved thermal model can be useful to rapidly predict a thermal behavior of film/substrate systems that are used for microelectronics.
In order to set up a list of libraries that you have access to,
you must first login
or sign up.
Then set up a personal list of libraries from your profile page by
clicking on your user name at the top right of any screen.