English, Article edition: PLATING OF COPPER LAYERS ON POLYIMIDES USING ELECTROLESS PLATING BY SURFACE MODIFICATION EUN SUN JI; YOUNG HWAN KIM; YONG CHEOL KANG; ...

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Bookmark: http://trove.nla.gov.au/version/84546
Physical Description
  • article
Language
  • English

Edition details

Title
  • PLATING OF COPPER LAYERS ON POLYIMIDES USING ELECTROLESS PLATING BY SURFACE MODIFICATION
Author
  • EUN SUN JI
  • YOUNG HWAN KIM
  • YONG CHEOL KANG
  • YOUNG SOO KANG
  • BYUNG HYUN AHN
Physical Description
  • article
Notes
  • This work describes electroless deposition of copper layers onto a polyimide (PI) film. The film was modified by etching with 1.0 M KOH solution treatment, and an activated Ag thin film was developed on this surface using 0.1 M AgNO3. The Cu layers were coated on the activated surface of polyimide films by electroless plating method. The thickness and surface morphology of Cu layers on the PI films were characterized with atomic force microscopy. The surface properties of PI film were identified with contact angle measurements.
  • RePEc:wsi:srlxxx:v:14:y:2007:i:04:p:593-596
Language
  • English
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